Wevo at trade fairs in China

March is the month of the electronics development and production trade fair Productronica China 2021 in Shanghai, and the China International Battery Fair (CIBF) 2021 in Shenzhen.

At both events, Wevo will be presenting customised solutions based on polyurethane, epoxy and silicone for casting, bonding and sealing.

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Schematic representation of a BMS printed circuit board onto which a polyurethane potting compound is being selectively applied using the dam-and-fill process.
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WEVOPUR 60210 FL T protects highly integrated BMS PCBs and supports automated dam-and-fill processes.

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3D rendering of a redox-flow battery stack.
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Safety and manufacturing efficiency require precisely tailored potting compounds, adhesives, sealants and gap fillers.

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