Encapsulating materials with high thermal conductivity can reliably absorb and dissipate the heat generated by e.g. circuit boards, ICs and motors during operation. Improved control and reduction of hot spots prolong component life and allow even smaller components to be designed.

Representative products

WEVOPOX 2513 / WEVODUR 1003/07

  • Thermal conductivity 1.4 W/m·K
  • Insulation class H (180 °C)
  • Thermosetting
  • Good impregnation characteristics



  • High thermal conductivity
  • Very elastic with damping properties
  • High thermal stability (200 °C)
  • Conventional thermal conductivity mats
  • Flame-retardant properties in accordance with UL 94 V-0

Resins with high thermal conductivity can prolong the service life of components.

Thermal conductivity with conventional fillers

Effect of thermal conductivity on component temperatures

The thermal conductivities of specially optimised high filler content resins exceed 1.5 W/m·K, while those of unfilled resins are only about 0.2 W/m·K. These optimised materials are available as liquids suitable for encapsulation and as thermal interface material (TIM) pastes.